Engineers fabricate inch-scale, ultrahard diamond wafers exceeding 200 GPa hardness

A research team co-led by Professor Yang Lu from the Department of Mechanical Engineering, Faculty of Engineering, The University of Hong Kong (HKU), and Professor Chengming Li from the Institute for Advanced Materials and Technology at University of Science and Technology Beijing (USTB), has successfully fabricated a free-standing ultrahard diamond wafer with a diameter of up to 5 inches, a thickness of 3 mm, and a Vickers hardness exceeding 200 GPa.