{
  "$type": "site.standard.document",
  "bskyPostRef": {
    "cid": "bafyreighsfabnnorprsbdqmqptyrg5ia3ee57jrotyczjb5n666e7fj7ey",
    "uri": "at://did:plc:k7h5fn3kdhjpj37pc6yhno2o/app.bsky.feed.post/3mjbc3gtlu5s2"
  },
  "coverImage": {
    "$type": "blob",
    "ref": {
      "$link": "bafkreicaq62szwayosmrf7blcsqe3bucidjh2rcbfwgc3mk6hwtqmkwrqq"
    },
    "mimeType": "image/jpeg",
    "size": 56123
  },
  "path": "/article/new-metal-with-triple-coppers-heat-conduction-challenges-fundamental-physics/",
  "publishedAt": "2026-04-11T11:00:00.000Z",
  "site": "https://www.scientificamerican.com",
  "textContent": "With performance three times better than copper’s, this new material could substantially improve heat management of electronics, data centers and energy systems",
  "title": "New metal with triple copper’s heat conduction challenges fundamental physics"
}