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  "path": "/heat-beneath-the-surface-thermal-metrology-for-advanced-semiconductor-materials-and-architectures/",
  "publishedAt": "2026-03-23T10:00:04.000Z",
  "site": "https://content.knowledgehub.wiley.com",
  "tags": [
    "Semiconductors",
    "Thermal-management",
    "Scaling",
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    "Download this free whitepaper now!"
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  "textContent": "\n\n\n\nAn in-depth examination of how rising power density, 3D integration, and novel materials are outpacing legacy thermal measurement — and what advanced metrology must deliver.\n\n**What Attendees will Learn**\n\n  1. Why heat is now the dominant constraint on semiconductor scaling — Explore how heterogeneous integration, 3D stacking, and AI-driven power density have shifted the primary bottleneck from lithography to thermal management, with heat flux projections exceeding 1,000 W/cm² for next-generation accelerators.\n\n  2. How extreme material properties are redefining thermal design requirements —Understand the measurement challenges posed by nanoscale thin films where bulk assumptions fail, engineered ultra-high-conductivity materials (diamond, BAs, BNNTs), and devices operating above 200 °C in wide-band gap systems.\n  3. Why interfaces and buried layers now govern reliability — Examine how thermal boundary resistance at bonded interfaces, TIM layers, and dielectric stacks has become a first-order reliability accelerator.\n  4. What a thermal-first design workflow looks like in practice — Learn how measured, scale-appropriate thermal properties can be integrated early in the design cycle to calibrate models, reduce uncertainty, and prevent costly late-stage failures across advanced packaging and 3D architectures.\n\n\n\nDownload this free whitepaper now!",
  "title": "Why Thermal Metrology Must Evolve for Next-Generation Semiconductors"
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