MediaTek’s Next AI Chip Strategy Could Bring Faster Cloud AI Features

MediaTek is preparing a major move in advanced semiconductor packaging, with reports suggesting that one of its next-generation chip projects will rely on Intel’s EMIB-T technology instead of TSMC’s widely used CoWoS solution. The project is reportedly targeting tape-out in Q4 2026, with mass production expected in Q4 2027, positioning MediaTek more aggressively in the […]