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  "path": "/the-secret-samsung-hpb-cooling-tech-inside-snapdragon-8-gen-6-pro-88821/",
  "publishedAt": "2026-02-10T07:33:16.000Z",
  "site": "https://xiaomitime.com",
  "tags": [
    "News",
    "@忙忙的灯草"
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  "textContent": "New leaks surfacing on February 10 via the Xianyu platform (user @忙忙的灯草) have exposed the packaging design for the upcoming Qualcomm Snapdragon 8 Elite Gen 6 Pro (SM8975). The leaked sketches highlight a significant shift in thermal management using Samsung’s HPB technology, alongside support for next-generation memory and storage standards. Advanced Thermal Architecture The Innovation: […]",
  "title": "The secret “Samsung HPB” cooling tech inside Snapdragon 8 Gen 6 Pro"
}