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  "path": "/2026/05/27/odroid-h5-sbc-review-part-1-unboxing-type1-case-assembly-and-first-boot/",
  "publishedAt": "2026-05-27T04:59:59.000Z",
  "site": "https://www.cnx-software.com",
  "tags": [
    "Hardware",
    "Intel Core",
    "Linux",
    "Testing",
    "Ubuntu",
    "Windows 11",
    "10GbE",
    "4k",
    "displayport",
    "fanless",
    "hardkernel",
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    "Reviews",
    "Single Board Computer",
    "ubuntu",
    "windows 11",
    "ODROID-H5 SBC Review – Part 1: Unboxing, Type1 case assembly, and first boot",
    "CNX Software - Embedded Systems News"
  ],
  "textContent": "Hardkernel has sent me a kit with the ODROID-H5 10GbE SBC for review. In addition to the Intel Core i3-300 board itself, the kit also comes with an ODROID-H5 Type-1 case, an M.2 card for a second 10 Gbps Ethernet port, and other accessories. I’ll start the review with an unboxing, my experience assembling the kit, and first boot using an M.2 NVMe SSD with Ubuntu 24.04 and Windows 11 in a dual-boot configuration. In a few weeks, I’ll continue the review after upgrading to Ubuntu 26.04 and perform thorough testing of all features and performance. ODROID-H5 kit unboxing An advantage of the ODROID family is that it’s highly flexible, and you can build your own customized system. For this review, Hardkernel sent me a package with the following items: External LED power button H5 Case Type 1 enclosure ODROID-H5 16GB DDR5 SO-DIMM (Crucial) 15V/4A PSU with US plug adapter [...]\n\nThe post ODROID-H5 SBC Review – Part 1: Unboxing, Type1 case assembly, and first boot appeared first on CNX Software - Embedded Systems News.",
  "title": "ODROID-H5 SBC Review – Part 1: Unboxing, Type1 case assembly, and first boot"
}