{
"$type": "site.standard.document",
"bskyPostRef": {
"cid": "bafyreia7d52rxo3cabh54cvpxdyttsekoxutg3rb3re2ohnyqz7svcbtyq",
"uri": "at://did:plc:dmpmpvgbtnjd7pz4pxvvcwle/app.bsky.feed.post/3mielxfkceqp2"
},
"path": "/2026/03/31/toradex-osm-and-lino-soms-30x30mm-nxp-i-mx-93-i-mx-91-modules-with-solder-down-or-b2b-connector-designs/",
"publishedAt": "2026-03-31T13:40:01.000Z",
"site": "https://www.cnx-software.com",
"tags": [
"Android",
"FreeRTOS",
"Hardware",
"Linux",
"NXP i.MX",
"Zephyr OS",
"camera",
"development kit",
"display",
"edge ai",
"freertos",
"industrial",
"IoT",
"osm",
"qnx",
"som",
"toradex",
"touchscreen",
"yocto",
"zephyr",
"Toradex OSM and Lino SoMs – 30×30mm NXP i.MX 93/i.MX 91 modules with solder-down or B2B connector designs",
"CNX Software - Embedded Systems News"
],
"textContent": "Toradex has launched two new ultra-compact (30x30mm) System-on-Module (SoM) families: OSM and Lino, powered by NXP i.MX 91 or i.MX 93 Arm Cortex-A55 SoC for Edge industrial and IoT applications. The OSM iMX91 and OSM iMX93 variants comply with the OSM Size-S standard, featuring a 332-ball contact grid designed to be soldered to the carrier board. The Lino is a proprietary format that keeps the OSM Size-S dimensions but features two board-to-board (B2B) connectors offering more flexibility for potential replacement or future upgrades. Toradex Lino iMX91/iMX93 system-on-module Toradex Lino specifications: SoC (one or the other) NXP i.MX 93 CPU 2x Arm Cortex-A55 up to 1.7 GHz 2x Arm Cortex-M33 up to 250 MHz GPU – PXP 2D GPU with blending/composition, resize, and color space conversion NPU – Arm Ethos-U65 NPU @ 1 GHz up to 0.5 TOPS Security – EdgeLock Secure Enclave NXP i.MX 91 CPU – Single-core Arm Cortex-A55 [...]\n\nThe post Toradex OSM and Lino SoMs – 30×30mm NXP i.MX 93/i.MX 91 modules with solder-down or B2B connector designs appeared first on CNX Software - Embedded Systems News.",
"title": "Toradex OSM and Lino SoMs – 30×30mm NXP i.MX 93/i.MX 91 modules with solder-down or B2B connector designs"
}