{
  "$type": "site.standard.document",
  "bskyPostRef": {
    "cid": "bafyreibwygck2bq4em4b2rkdvychc4sy6xc3pteeoqmzfmvwlpdbi2376q",
    "uri": "at://did:plc:avkh7zze5iapdkk6naaunrjn/app.bsky.feed.post/3mj24iaj26st2"
  },
  "path": "/260409/p4#a260409p4",
  "publishedAt": "2026-04-09T05:35:46.000Z",
  "site": "http://www.techmeme.com",
  "tags": [
    "CNBC",
    "TSMC says its most advanced chip packaging tech, CoWoS, is growing at an 80% CAGR as it ramps up capacity; Nvidia has reportedly reserved most of the capacity"
  ],
  "textContent": "Katie Tarasov / CNBC:\n**TSMC says its most advanced chip packaging tech, CoWoS, is growing at an 80% CAGR as it ramps up capacity; Nvidia has reportedly reserved most of the capacity** — An underappreciated step in the chipmaking process is poised to become the next bottleneck for artificial intelligence.",
  "title": "TSMC says its most advanced chip packaging tech, CoWoS, is growing at an 80% CAGR as it ramps up capacity; Nvidia has reportedly reserved most of the capacity (Katie Tarasov/CNBC)"
}