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  "path": "/tech-industry/semiconductors/sk-hynix-unveils-ihbm-thermal-architecture-that-cools-ai-memory-at-the-source-integrated-cooling-elements-inside-hbm-interface-cut-thermal-resistance-by-30-percent-target-next-gen-hbm5-accelerators-and-dense-ai-data-centers",
  "publishedAt": "2026-05-26T11:49:14.000Z",
  "site": "https://www.tomshardware.com",
  "tags": [
    "Semiconductors",
    "Tech Industry",
    "Manufacturing"
  ],
  "textContent": "SK hynix has unveiled iHBM, a new thermal packaging architecture that embeds cooling elements directly into the HBM interface layer, reducing thermal resistance by 30% and helping future AI accelerators avoid performance-killing thermal throttling.",
  "title": "SK hynix unveils 'iHBM' thermal architecture that cools AI memory at the source — integrated cooling elements inside HBM interface cut thermal resistance by 30%, target next-gen HBM5 accelerators and dense AI data centers"
}