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  "path": "/tech-industry/samsungs-bonus-dispute-spreads-to-chip-packaging-divisions-threatening-hbm-delivery-schedules",
  "publishedAt": "2026-05-23T13:49:57.000Z",
  "site": "https://www.tomshardware.com",
  "tags": [
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  "textContent": "It’s understood that meetings are being canceled across Samsung's non-memory and shared business units.",
  "title": "Samsung's $400,000 payout for memory workers sparks revolt as other divisions get only $4,000, fueling intentional production slowdowns — internal resentment disrupts packaging operations, major AI chip project decisions to a complete halt"
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