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  "path": "/tech-industry/semiconductors/intel-reportedly-in-talks-with-google-and-amazon-over-advanced-packaging",
  "publishedAt": "2026-04-07T10:20:00.000Z",
  "site": "https://www.tomshardware.com",
  "tags": [
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  "textContent": "Intel is understood to be in active talks with Google and Amazon to provide advanced chip packaging services for their custom AI ASICs.",
  "title": "Intel reportedly in talks with Google and Amazon over advanced packaging — major customers could take advantage of EMIB-T later this year"
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