{
  "$type": "site.standard.document",
  "bskyPostRef": {
    "cid": "bafyreibm5yt25nmpgt4hzhbbujgsocpaxgs3ug7dh5xjzl7fmdxrx7gkha",
    "uri": "at://did:plc:ajcrkmnlj6rxdk7rltijv227/app.bsky.feed.post/3mgxngbvl2bn2"
  },
  "coverImage": {
    "$type": "blob",
    "ref": {
      "$link": "bafkreig7niopoyqtyeca6bco75ixodw47c26fdbzxlz5rwlmwr2eylzis4"
    },
    "mimeType": "image/jpeg",
    "size": 172225
  },
  "path": "/tech-industry/artificial-intelligence/tech-titans-team-up-to-form-optical-interconnect-alliance-to-solve-the-ai-buildouts-big-data-bottleneck-nvidia-amd-broadcom-and-more-set-sights-on-building-phy-to-break-through-the-limitations-of-copper",
  "publishedAt": "2026-03-13T18:14:06.000Z",
  "site": "https://www.tomshardware.com",
  "tags": [
    "Artificial Intelligence",
    "Tech Industry"
  ],
  "textContent": "AMD, Nvidia, Microsoft, Broadcom, and Meta have formed an Optical Compute Interconnect Multi-Source Agreement (OCI MSA) to develop a standardized optical interconnect for AI data centers, with the aspiration to build a PHY capable of handling speeds of up to 3.2 Tb/s.",
  "title": "Tech titans team up to form optical interconnect alliance to solve the AI buildout's big data bottleneck — Nvidia, AMD, Broadcom & more set sights on building PHY to break through the limitations of copper",
  "updatedAt": "2026-03-13T18:14:07.000Z"
}